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Flash

EEPROM

MCU

Analog

KGD Service

SPI NOR Flash

Automotive Flash

Standard EEPROM

Automotive EEPROM

PY32 Series

VCM driver

Flash

EEPROM

MCU

Analog

L Series 1.65V~2.0V

H Series 2.3V～3.6V

U Series 1.65V～3.6V

N Series 1.1V～2.0V

WLCSP

L Series 1.65V～2.0V

H Series 2.3V～3.6V

L Series 1.65V～2.0V

SPI EEPROM

I²C EEPROM

WLCSP

CCM

SPI EEPROM

I²C EEPROM

Value

Main

Ultra low power

Touch Series

WLCSP

SPI NOR Flash

PY32F002B

PY32F031

PY32F032

PY32F040

PY32F071

PY32F072

PY32F403

PY32L020

PY32L090

PY32T020

PY32T090

PY32T092

H Series

L Series

U Series

Application

Mobile Phone PC and Peripherals Industry Automotive Electronics Consumer Electronics IOT

Solution

Download

Datasheet User Manual Application Note Application plan Evaluation Board Tools & Software Video EP information Others

News

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Recruitment link

HR phone number:

86-21-61347010

HR Email:

talent@puyasemi.com

Recruitment Information

Employee Style

Talent Development

Company Benefits

Recruitment Information

Social Recruitment

Campus Recruitment

All Develop Product Sales Quality

MCU應(yīng)用測(cè)試工程師

1 people

上海

2024.01.11

Job responsibilities

1、根據(jù)MCU產(chǎn)品設(shè)計(jì)規(guī)格書制定驗(yàn)證方案及計(jì)劃，實(shí)施芯片驗(yàn)證、輸出測(cè)試報(bào)告

2、開發(fā)MCU測(cè)試程序，測(cè)試平臺(tái)等軟硬件工作

3、開發(fā)系統(tǒng)級(jí)測(cè)試平臺(tái)，完成板級(jí)功能測(cè)試，提高驗(yàn)證覆蓋率

4、針對(duì)測(cè)試結(jié)果進(jìn)行分析，確認(rèn)芯片的功能和性能與設(shè)計(jì)的符合度

5、編寫規(guī)格書，參考手冊(cè)，應(yīng)用手冊(cè)等技術(shù)文檔

6、協(xié)同研發(fā)、FAE等進(jìn)行新產(chǎn)品的debug

Submit

MCU應(yīng)用測(cè)試工程師

1 people

蘇州

2024.01.11

Job responsibilities

1、負(fù)責(zé)MCU芯片F(xiàn)PGA驗(yàn)證及新樣品（包含數(shù)字電路和模擬電路）的測(cè)試

2、依據(jù)芯片設(shè)計(jì)規(guī)格書，設(shè)計(jì)芯片驗(yàn)證平臺(tái)，制定驗(yàn)證方案，實(shí)施芯片驗(yàn)證、輸出測(cè)試報(bào)告

3、開發(fā)芯片測(cè)試相關(guān)Firmware程序

4、針對(duì)驗(yàn)證結(jié)果進(jìn)行分析，確認(rèn)芯片的功能和性能與設(shè)計(jì)的符合度，編寫規(guī)格書，參考手冊(cè)，應(yīng)用手冊(cè)等文檔

5、協(xié)同研發(fā)、FAE等進(jìn)行新產(chǎn)品的debug

Submit

MCU資深測(cè)試工程師

1 people

上海

2024.01.11

Job responsibilities

1、負(fù)責(zé)MCU芯片F(xiàn)PGA驗(yàn)證及新樣品的測(cè)試

2、根據(jù)芯片規(guī)格，設(shè)計(jì)芯片驗(yàn)證平臺(tái)，制定驗(yàn)證方案，實(shí)施芯片驗(yàn)證、輸出測(cè)試報(bào)告

3、開發(fā)芯片測(cè)試相關(guān)Firmware程序

4、針對(duì)驗(yàn)證結(jié)果進(jìn)行分析，確認(rèn)芯片的功能和性能與設(shè)計(jì)的符合度

5、協(xié)同研發(fā)、FAE等進(jìn)行新產(chǎn)品的debug

Submit

MCU應(yīng)用測(cè)試(高級(jí))經(jīng)理

1 people

上海

2024.01.11

Job responsibilities

1、負(fù)責(zé)整個(gè)MCU產(chǎn)品FPGA以及封裝片的測(cè)試驗(yàn)證工作

2、依據(jù)芯片設(shè)計(jì)規(guī)格書，制定驗(yàn)證方案，搭建芯片驗(yàn)證平臺(tái)，完成芯片驗(yàn)證并輸出測(cè)試報(bào)告

3、開發(fā)芯片測(cè)試相關(guān)軟件硬件工作，提高測(cè)試效率

4、針對(duì)驗(yàn)證結(jié)果進(jìn)行分析，確認(rèn)芯片的功能和性能與設(shè)計(jì)的符合度

5、編寫MCU產(chǎn)品規(guī)格書，參考手冊(cè)，應(yīng)用手冊(cè)等相關(guān)配套技術(shù)文檔

6、協(xié)同研發(fā)、FAE等進(jìn)行新產(chǎn)品的debug

7、協(xié)同研發(fā)、支持TE進(jìn)行量產(chǎn)向量pattern開發(fā)

8、公司安排的其他工作

Submit

1 2 3 4 5

Employee Style

2018 Annual Meeting

2023 Annual Meeting

A place with wind

2019 Annual Meeting

2023 Annual Meeting

Training Awards

2019 Annual Meeting

Training Review

New Year Run

2019 Annual Meeting

New Year Run

Christmas

Birthday party

Talent Development

New employee training

Company introduction, corporate culture, human resources, rules and regulations, workplace etiquette, professional competitiveness, effective communication

Skills training

Research and development, production and manufacturing, quality and reliability, engineering application statistics, safety and environmental protection